98 Series Tin and Tin/Lead Technology

980 Immersion Tin : Formulated to deposit a thin, virtually pore free layer of tin on copper. Treated copper will retain solderability for long periods. Datasheet

981TK Tin/Lead Process : High performance tin/lead electroplating process showing excellent throwing power. Alloy composition is maintained across a wide current density range. Deposits have superb fusing characteristics. Datasheet

983 Dull Tin : A sulphate based tin etch resist. Datasheet

985, 986, MFS 1201 Solder Conditioners : Used prior to IR or hot oil fusing. Removes etch residues, cleans and activates exposed copper to ensure bright even fused finish. 985 986 MFS 1201

987, 9870 Solder Conditioners : Advanced non thiourea formulation for use where environmental conditions restrain conventional chemistry. 9870

Solder Bar : High purity solder of 63:37 alloy composition.