95 Series Multi-Layer Technology
SP 230, SP230EX Black Oxide : Single component, self limiting oxide treatment. Cost effective, easy to control product suitable for immersion or flood conveyor systems. SP 230 SP 230EX
SP 2302 Additive : Liquid use when making up a new oxide bath using SP 230EX.
952(80) Post Treatment: DMAB system used after oxide to chemically reduce the oxide to copper metal. Eliminates pink ring/micro delamination whilst retaining the black appearance of boards after bonding. Datasheet
9550 Cirbond : Revolutionary, single stage, inner layer etching process replacing oxide/post treatment. Low temperature, bleed and feed, extremely fast process produces dark brown even etched layers for bonding. Boards are easily handled and retain dark brown appearance when bonded. Datasheet
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