Electroless Nickel Processes

Ni-Star

The comprehensive Ni-Star range of electroless nickel processes has been developed to provide optimum deposition speeds from highly stable solutions. Phosphorus contents range from 4-14% and hardness of 450-750 VHN can be increased to 750-1100 VHN with heat treatment.

Ni-Star MP : Bright, medium phosphorus (4-6%) deposits, consistent through bath life. Excellent for plating on aluminium. Datasheet

Ni-Star MP (AF) (CAF) : (AF) ammonia free version of Ni-Star MP. (CAF) cadmium and ammonia free version of Ni-Star MP. Datasheet(AF) Datasheet(CAF)

Ni-Star HP : Ductile, high phosphorus (10-14%) deposits with optimum corrosion resistance, suitable for marine environments. Datasheet

Ni-Star HP BR : Bright version of Ni-Star HP. Datasheet

Ni-Star HP (AF) : Ammonia free high phosphorous electroless nickel.Datasheet

Ni-Star SP : Designed to convert a Ni-Star HP bath after 4 MTO's to a medium phosphorus process and thereby allow a further 3-5 MTO's. Datasheet

Ni-Star Superbrite : Deposits a uniform, extremely bright deposit at thicknesses of 5-10 microns. Datasheet

Ni-Star Strike/Ni-Star Strike (AF) : Alkaline process to produce thin nickel deposits on zincated aluminium and hence protect the main EN solution from contamination therefore extending bath life. (AF) is an ammonia-free version. Datasheet Strike Datasheet Strike(AF)

Ni-Shield

Ni-Shield G : Specially developed electroless nickel-plating process designed to plate directly onto magnesium substrates. Datasheet